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Tokuyama Ee-Bond - Intro Kit
Tokuyama Ee-Bond - Intro Kit
Tokuyama Ee-Bond - Intro Kit

Tokuyama Ee-Bond - Intro Kit

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₹6,490.00 ₹7,000.00 -7%
Brand: Tokuyama
Product Code: TOKYM-EBIK
Availability: In Stock

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Bonding Agent

Bonding Agent

TOKUYAMA® EE-BOND is a dental adhesive system formulated for the enamel-etching technique. Utilizing Tokuyama's 3D self-reinforcing (SR) monomer, TOKUYAMA® EE-BOND chemically bonds to both enamel and dentin forming a durable 3D matrix bonding layer. This thin but durable bonding layer offers long-term marginal integrity of the esthetic restoration as well as exceptional dentinal sealing.

 

INDICATIONS

Bonding of light- or dual-cured composite to:
1. cut/uncut enamel
2. cut/uncut dentin
3. fractured porcelain/composite repair



Features:

  • Reduced post-operative sensitivity
  • Perfect cavity sealing
  • Less technique sensitivity
  • Prolonged working time
  • Fluoride releasing
  • Outstanding adhesion performance
  • Dependable marginal integrity (Minimized micro-leakage)


  • Packaging:
      • EE-BOND Bottle / 5mL
      • Applicator x 25
      • Dispensing well
      • TOKUYAMA ETCHING GEL HV Syringe / 2.5mL
      • Syringe Tip x 10

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